Rainbow-electronics DS1386 Manuel d'utilisateur télécharger pdf (Page 18)

DS1386/1386P

18 of 20

DS1386P

PKG INCHES

DIM MIN NOM MAX

A 0.920 0.925 0.930

B 0.980 0.985 0.990

C - - 0.080

D 0.052 0.055 0.058

E 0.048 0.050 0.052

F 0.015 0.020 0.025

G 0.025 0.027 0.030

NOTE:

For the PowerCap Version:

a. Dallas Semiconductor recommends that PowerCap module bases experience one pass though

solder reflow oriented with the label side up (“live-bug”).

b. Hand soldering and touch-up: do not touch or apply the soldering iron to leads for more than

3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove

the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to

remove solder.

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Rainbow-electronics DS1386 Manuel d'utilisateur Page 18