Rainbow-electronics ADC08D1000 Manuel d'utilisateur Page 31

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2.0 Applications Information
(Continued)
Failure to provide adequate heat removal. As described in
Section 2.6.2, it is important to provide adequate heat re-
moval to ensure device reliability. This can either be done
with adequate air flow or the use of a simple heat sink built
into the board. The backside pad should be grounded for
best performance.
ADC08D1000
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